منابع مشابه
Trends in R&D in TSV Technology for 3D LSI Packaging
Small, high-speed, and multi-functional computers and other electronic devices have been enabled by high integration technologies that have come to reality by the miniaturization through the LSI process scaling which uses a very fine pattern. However, an upper limit in the progress of such miniaturization has come into sight. The miniaturization will be technologically limited due to the increa...
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LSIs that adopt advanced technologies, as represented by imaging LSIs, now contain 30 million or more logic gates and the scale is beginning to approach the level of 100 million gates. As compared with the 90 nm process generation, this is three to ten times the number of gates. With advanced technologies such as 40 nm and 28 nm, the process characteristics become remarkably complex and wiring ...
متن کاملModern Electronic Packaging Technology
A view of modern electronic packaging technology is presented along with its applications at APL. Although not always distinct, electronic packaging may be separated into three levels: component, board, and system. The manufacturing technologies and designs may vary at each level, but they all must provide electrical interconnection, thermal management, and mechanical and environmental protecti...
متن کاملSemiconductor Packaging Assembly Technology
This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board (PCB). Another function is to provide the desired mechanical and environmental protection to ensure reliability and performance. Three fundamental assembly flow processes ...
متن کاملPast and Future Technology for Mixed Signal LSI
This paper discusses Mixed Signal LSI technology with embedded power transistors. Trends in Mixed Signal LSI technology are explained at first. Mixed signal LSI technology has proceeded with the help of fine fabrication technology and SOI technology. The BEOL transistor is a new development, which uses InGaZnO (IGZO) as its TFT channel material. The BEOL transistor is one future device which en...
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ژورنال
عنوان ژورنال: Journal of SHM
سال: 1998
ISSN: 1884-1198,0919-4398
DOI: 10.5104/jiep1993.14.11